TBDB Tape (Development) > film_tape

Film&Tape

MTI ECO INNOVATION

TBDB (Temporary Bonding De-Bonding)

MTI Temporary Bonding De-bonding Solution Applied Tape for State-of-the-art Semiconductor Packaging

Solving heat and chemical resistance challenges.
Sophisticated Fan-out Packaging Solution in WLCSP, PLP process.
Tape applied with TRA (Thermal Release Adhesive) for large-area high-speed transfer.

FOWLP (Fan-out Wafer Level Packaging)
Supporting the front-end processed semiconductor wafers to the back-end process.
No damage to the substrate and no residue after separation from the carrier.
No pre-foaming in the foam layer.
No die drift or shift in the clear layer.

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